| 9526285 |
Flexible computing fabric |
Aleksandar Aleksov, Ravindranath V. Mahajan, Sairam Agraharam, Ian A. Young, John C. Johnson +1 more |
2016-12-27 |
| 9520376 |
Bumpless build-up layer package including an integrated heat spreader |
Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, Tannaz Harirchian |
2016-12-13 |
| 9496211 |
Logic die and other components embedded in build-up layers |
Deepak Kulkarni, Russell K. Mortensen |
2016-11-15 |
| 9490196 |
Multi die package having a die and a spacer layer in a recess |
Weng Hong Teh, Shan Zhong |
2016-11-08 |
| 9406618 |
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same |
Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi, Mohit Mamodia +2 more |
2016-08-02 |
| 9397071 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more |
2016-07-19 |
| 9374509 |
Wearable imaging sensor for communications |
Ravi Pillarisetty, Sairam Agraharam, Christopher J. Jezewski |
2016-06-21 |
| 9368455 |
Electromagnetic interference shield for semiconductor chip packages |
Ravindranath V. Mahajan, Adel A. Elsherbini, Nitin A. Deshpande |
2016-06-14 |
| 9312233 |
Method of forming molded panel embedded die structure |
Rahul N. Manepalli, Hamid Azimi |
2016-04-12 |
| 9287248 |
Embedded memory and power management subpackage |
Debendra Mallik, Sasha N. Oster, Timothy McIntosh |
2016-03-15 |
| 9269701 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2016-02-23 |
| 9257380 |
Forming functionalized carrier structures with coreless packages |
Ravi Kiran Nalla, Javier Soto Gonzalez, Drew W. Delaney, Hamid Azimi |
2016-02-09 |