Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Tannaz Harirchian, John S. Guzek | 2016-12-13 |
| 9437569 | High density substrate routing in BBUL package | Weng Hong Teh | 2016-09-06 |
| 9349703 | Method for making high density substrate interconnect using inkjet printing | Kinya Ichikawa, Robert L. Sankman | 2016-05-24 |
| 9275971 | Bridge interconnect with air gap in package assembly | Zhiguo Qian, Mathew J. Manusharow | 2016-03-01 |
| 9269701 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan | 2016-02-23 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Kinya Ichikawa, Yoshihiro Tomita, Robert L. Sankman, Eric J. Li | 2016-02-16 |
| 9244487 | Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices | Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale | 2016-01-26 |
| 9241423 | Fluid-cooled heat dissipation device | — | 2016-01-19 |