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Bumpless build-up layer package including an integrated heat spreader |
Weng Hong Teh, Deepak Kulkarni, Tannaz Harirchian, John S. Guzek |
2016-12-13 |
| 9437569 |
High density substrate routing in BBUL package |
Weng Hong Teh |
2016-09-06 |
| 9349703 |
Method for making high density substrate interconnect using inkjet printing |
Kinya Ichikawa, Robert L. Sankman |
2016-05-24 |
| 9275971 |
Bridge interconnect with air gap in package assembly |
Zhiguo Qian, Mathew J. Manusharow |
2016-03-01 |
| 9269701 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan |
2016-02-23 |
| 9263329 |
Methods of connecting a first electronic package to a second electronic package |
Kinya Ichikawa, Yoshihiro Tomita, Robert L. Sankman, Eric J. Li |
2016-02-16 |
| 9244487 |
Integrated translational land-grid array sockets and loading mechanisms for semiconductive devices |
Russell S. Aoki, Anthony P. Valpiani, Barry T. Dale |
2016-01-26 |
| 9241423 |
Fluid-cooled heat dissipation device |
— |
2016-01-19 |