Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9515017 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2016-12-06 |
| 9368437 | High density package interconnects | Sanka Ganesan, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2016-06-14 |
| 9275971 | Bridge interconnect with air gap in package assembly | Chia-Pin Chiu, Mathew J. Manusharow | 2016-03-01 |
| 9240377 | X-line routing for dense multi-chip-package interconnects | Kemal Aygun | 2016-01-19 |
| 9230900 | Ground via clustering for crosstalk mitigation | Kemal Aygun, Yu Zhang | 2016-01-05 |
| 9232639 | Non-uniform substrate stackup | Zhichao Zhang, Tao Wu, Kemal Aygun | 2016-01-05 |