Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368437 | High density package interconnects | Zhiguo Qian, Robert L. Sankman, Krishna Srinivasan, Zhaohui Zhu | 2016-06-14 |
| 9332643 | Interconnect architecture with stacked flex cable | Timothy Swettlen, Gary Long, Donald T. Tran, Jill D. Murfin, David I. Amir | 2016-05-03 |
| 9324678 | Low profile zero/low insertion force package top side flex cable connector architecture | Ram Viswanath | 2016-04-26 |
| 9265170 | Integrated circuit connectors | Rajasekaran Swaminathan, Ram Viswanath, Gaurav Chawla, Joshua D. Heppner, Jeffory L. Smalley +4 more | 2016-02-16 |
| 9233835 | Shaped and oriented solder joints | Aleksandar Aleksov | 2016-01-12 |