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3D integrated circuit package with through-mold first level interconnects |
Debendra Mallik |
2016-12-27 |
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Integration of embedded thin film capacitors in package substrates |
Daniel N. Sobieski, Sri Ranga Sai Boyapati |
2016-08-16 |
| 9374162 |
Semiconductor package with optical port |
Johanna M. Swan, Dmitri E. Nikonov, Raseong Kim |
2016-06-21 |
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High density package interconnects |
Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu |
2016-06-14 |
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Method for making high density substrate interconnect using inkjet printing |
Chia-Pin Chiu, Kinya Ichikawa |
2016-05-24 |
| 9310565 |
Cloaking system with waveguides |
Ian A. Young, Johanna M. Swan, Marko Radosavljevic |
2016-04-12 |
| 9297824 |
Techniques, systems and devices related to acceleration measurement |
Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more |
2016-03-29 |
| 9263329 |
Methods of connecting a first electronic package to a second electronic package |
Chia-Pin Chiu, Kinya Ichikawa, Yoshihiro Tomita, Eric J. Li |
2016-02-16 |