Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530758 | 3D integrated circuit package with through-mold first level interconnects | Debendra Mallik | 2016-12-27 |
| 9420693 | Integration of embedded thin film capacitors in package substrates | Daniel N. Sobieski, Sri Ranga Sai Boyapati | 2016-08-16 |
| 9374162 | Semiconductor package with optical port | Johanna M. Swan, Dmitri E. Nikonov, Raseong Kim | 2016-06-21 |
| 9368437 | High density package interconnects | Sanka Ganesan, Zhiguo Qian, Krishna Srinivasan, Zhaohui Zhu | 2016-06-14 |
| 9349703 | Method for making high density substrate interconnect using inkjet printing | Chia-Pin Chiu, Kinya Ichikawa | 2016-05-24 |
| 9310565 | Cloaking system with waveguides | Ian A. Young, Johanna M. Swan, Marko Radosavljevic | 2016-04-12 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more | 2016-03-29 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Kinya Ichikawa, Yoshihiro Tomita, Eric J. Li | 2016-02-16 |