| 9507086 |
Optical I/O system using planar light-wave integrated circuit |
Mauro J. Kobrinsky, Henning Braunisch, Shawna M. Liff, Peter L. D. Chang, Bruce A. Block |
2016-11-29 |
| 9445496 |
Glass clad microelectronic substrate |
Qing Ma |
2016-09-13 |
| 9429427 |
Inductive inertial sensor architecture and fabrication in packaging build-up layers |
Qing Ma, Feras Eid, Kevin Lin, Weng Hong Teh, Valluri Rao |
2016-08-30 |
| 9406618 |
Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same |
John S. Guzek, Ravi Kiran Nalla, Javier Solo Gonzalez, Drew W. Delaney, Suresh Pothukuchi +2 more |
2016-08-02 |
| 9397071 |
High density interconnection of microelectronic devices |
Omkar G. Karhade, John S. Guzek, Christopher J. Nelson, Nitin A. Deshpande, William J. Lambert +6 more |
2016-07-19 |
| 9374162 |
Semiconductor package with optical port |
Robert L. Sankman, Dmitri E. Nikonov, Raseong Kim |
2016-06-21 |
| 9368429 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Qing Ma, Min Tao, Charles A. Gealer, Edward A. Zarbock |
2016-06-14 |
| 9361059 |
Architecture for seamless integrated display system |
Uygar E. Avci, Islam A. Salama, Ravi Pallarisetty |
2016-06-07 |
| 9310565 |
Cloaking system with waveguides |
Ian A. Young, Robert L. Sankman, Marko Radosavljevic |
2016-04-12 |
| 9297824 |
Techniques, systems and devices related to acceleration measurement |
Qing Ma, Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh +1 more |
2016-03-29 |
| 9275969 |
Optical interconnect on bumpless build-up layer package |
Feras Eid, Weng Hong Teh |
2016-03-01 |