Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Min Tao, Edward A. Zarbock | 2016-06-14 |