Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Qing Ma, Johanna M. Swan, Charles A. Gealer, Edward A. Zarbock | 2016-06-14 |