| 9461010 |
Debond interconnect structures |
Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more |
2016-10-04 |
| 9445496 |
Glass clad microelectronic substrate |
Johanna M. Swan |
2016-09-13 |
| 9429427 |
Inductive inertial sensor architecture and fabrication in packaging build-up layers |
Feras Eid, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri Rao |
2016-08-30 |
| 9420707 |
Substrate for integrated circuit devices including multi-layer glass core and methods of making the same |
Chuan Hu, Patrick Morrow |
2016-08-16 |
| 9368429 |
Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips |
Johanna M. Swan, Min Tao, Charles A. Gealer, Edward A. Zarbock |
2016-06-14 |
| 9297824 |
Techniques, systems and devices related to acceleration measurement |
Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more |
2016-03-29 |
| 9269686 |
Debond interconnect structures |
Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more |
2016-02-23 |
| 9267944 |
Biosensor utilizing a resonator having a functionalized surface |
Yuegang Zhang, Andrew Berlin, Li-Peng Wang, Valluri Rao, Mineo Yamakawa |
2016-02-23 |
| 9250261 |
Method, apparatus and system for providing metering of acceleration |
Kevin Lin, Feras Eid |
2016-02-02 |