Qing Ma — 9 Patents at Intel | Patent Leaderboard

Issued Patents 2016

Showing 1–9 of 9 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9461010	Debond interconnect structures	Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more	2016-10-04	$11,494,000
9445496	Glass clad microelectronic substrate	Johanna M. Swan	2016-09-13	$11,798,000
9429427	Inductive inertial sensor architecture and fabrication in packaging build-up layers	Feras Eid, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri Rao	2016-08-30	$15,019,000
9420707	Substrate for integrated circuit devices including multi-layer glass core and methods of making the same	Chuan Hu, Patrick Morrow	2016-08-16	$10,311,000
9368429	Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips	Johanna M. Swan, Min Tao, Charles A. Gealer, Edward A. Zarbock	2016-06-14	$9,885,000
9297824	Techniques, systems and devices related to acceleration measurement	Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more	2016-03-29	$14,056,000
9269686	Debond interconnect structures	Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more	2016-02-23	$10,383,000
9267944	Biosensor utilizing a resonator having a functionalized surface	Yuegang Zhang, Andrew Berlin, Li-Peng Wang, Valluri Rao, Mineo Yamakawa	2016-02-23	$10,383,000
9250261	Method, apparatus and system for providing metering of acceleration	Kevin Lin, Feras Eid	2016-02-02	$9,951,000