Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461010 | Debond interconnect structures | Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-10-04 |
| 9445496 | Glass clad microelectronic substrate | Johanna M. Swan | 2016-09-13 |
| 9429427 | Inductive inertial sensor architecture and fabrication in packaging build-up layers | Feras Eid, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri Rao | 2016-08-30 |
| 9420707 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Chuan Hu, Patrick Morrow | 2016-08-16 |
| 9368429 | Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chips | Johanna M. Swan, Min Tao, Charles A. Gealer, Edward A. Zarbock | 2016-06-14 |
| 9297824 | Techniques, systems and devices related to acceleration measurement | Valluri Rao, Feras Eid, Kevin Lin, Weng Hong Teh, Johanna M. Swan +1 more | 2016-03-29 |
| 9269686 | Debond interconnect structures | Jun He, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-02-23 |
| 9267944 | Biosensor utilizing a resonator having a functionalized surface | Yuegang Zhang, Andrew Berlin, Li-Peng Wang, Valluri Rao, Mineo Yamakawa | 2016-02-23 |
| 9250261 | Method, apparatus and system for providing metering of acceleration | Kevin Lin, Feras Eid | 2016-02-02 |