Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461010 | Debond interconnect structures | Qing Ma, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-10-04 |
| 9437545 | Interconnects having sealing structures to enable selective metal capping layers | Kevin J. Fischer, Ying Zhou, Peter K. Moon | 2016-09-06 |
| 9269686 | Debond interconnect structures | Qing Ma, Patrick Morrow, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-02-23 |