Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461010 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-10-04 |
| 9391447 | Interposer to regulate current for wafer test tooling | Evan M. Fledell, Roy E. Swart, Timothy J. Maloney, Jack D. Pippin | 2016-07-12 |
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Patrick Morrow, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-02-23 |