Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9490201 | Methods of forming under device interconnect structures | Don Nelson, M. Clair Webb, Kimin Jun, Il-Seok Son | 2016-11-08 |
| 9461010 | Debond interconnect structures | Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-10-04 |
| 9420707 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Qing Ma, Chuan Hu | 2016-08-16 |
| 9269686 | Debond interconnect structures | Qing Ma, Jun He, Paul B. Fischer, Sridhar Balakrishnan, Satish Radhakrishnan +2 more | 2016-02-23 |