Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530747 | Solder in cavity interconnection structures | Shawna M. Liff, Gregory S. Clemons | 2016-12-27 |
| 9508675 | Microelectronic package having direct contact heat spreader and method of manufacturing same | Daoqiang Lu, Gilroy Vandentop, Shriram Ramanathan, Rajashree Baskaran, Valery M. Dubin | 2016-11-29 |
| 9461355 | Method apparatus and material for radio frequency passives and antennas | Vijay K. Nair, Shawna M. Liff, Larry E. Mosley | 2016-10-04 |
| 9420707 | Substrate for integrated circuit devices including multi-layer glass core and methods of making the same | Qing Ma, Patrick Morrow | 2016-08-16 |
| 9281292 | Single layer low cost wafer level packaging for SFF SiP | Vijay K. Nair | 2016-03-08 |