Issued Patents 2016
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530747 | Solder in cavity interconnection structures | Chuan Hu, Gregory S. Clemons | 2016-12-27 |
| 9520378 | Thermal matched composite die | Aleksandar Aleksov | 2016-12-13 |
| 9507086 | Optical I/O system using planar light-wave integrated circuit | Mauro J. Kobrinsky, Henning Braunisch, Peter L. D. Chang, Bruce A. Block, Johanna M. Swan | 2016-11-29 |
| 9502368 | Picture frame stiffeners for microelectronic packages | Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Kinya Ichikawa, Nitin A. Deshpande | 2016-11-22 |
| 9461355 | Method apparatus and material for radio frequency passives and antennas | Vijay K. Nair, Chuan Hu, Larry E. Mosley | 2016-10-04 |
| 9435967 | Optical connection techniques and configurations | Henning Braunisch, Peter L. D. Chang | 2016-09-06 |
| 9391427 | Thermal management in packaged VCSELs | Feras Eid, Henning Braunisch | 2016-07-12 |
| 9377594 | Two-dimensional, high-density optical connector | Jia-Hung Tseng, Peter L. D. Chang | 2016-06-28 |
| 9310553 | Optical connection techniques and configurations | Henning Braunisch, Peter L. D. Chang | 2016-04-12 |
| 9275955 | Integrated circuit package with embedded bridge | Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande | 2016-03-01 |