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Solder in cavity interconnection structures |
Chuan Hu, Gregory S. Clemons |
2016-12-27 |
| 9520378 |
Thermal matched composite die |
Aleksandar Aleksov |
2016-12-13 |
| 9507086 |
Optical I/O system using planar light-wave integrated circuit |
Mauro J. Kobrinsky, Henning Braunisch, Peter L. D. Chang, Bruce A. Block, Johanna M. Swan |
2016-11-29 |
| 9502368 |
Picture frame stiffeners for microelectronic packages |
Yoshihiro Tomita, Jiro Kubota, Omkar G. Karhade, Kinya Ichikawa, Nitin A. Deshpande |
2016-11-22 |
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Method apparatus and material for radio frequency passives and antennas |
Vijay K. Nair, Chuan Hu, Larry E. Mosley |
2016-10-04 |
| 9435967 |
Optical connection techniques and configurations |
Henning Braunisch, Peter L. D. Chang |
2016-09-06 |
| 9391427 |
Thermal management in packaged VCSELs |
Feras Eid, Henning Braunisch |
2016-07-12 |
| 9377594 |
Two-dimensional, high-density optical connector |
Jia-Hung Tseng, Peter L. D. Chang |
2016-06-28 |
| 9310553 |
Optical connection techniques and configurations |
Henning Braunisch, Peter L. D. Chang |
2016-04-12 |
| 9275955 |
Integrated circuit package with embedded bridge |
Ravindranath V. Mahajan, Christopher J. Nelson, Omkar G. Karhade, Feras Eid, Nitin A. Deshpande |
2016-03-01 |