Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502368 | Picture frame stiffeners for microelectronic packages | Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2016-11-22 |
| 9472519 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Leonel Arana, Yosuke Kanaoka | 2016-10-18 |
| 9412702 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2016-08-09 |
| 9380697 | Electronic device and manufacturing method for same | Mitsuhiro Kasahara | 2016-06-28 |
| 9373762 | Electronic part package | Susumu Sawada, Koji Kawakita, Masanori Nomura | 2016-06-21 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Kinya Ichikawa, Robert L. Sankman, Eric J. Li | 2016-02-16 |