Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9472519 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Yoshihiro Tomita, Yosuke Kanaoka | 2016-10-18 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Gregory S. Constable, Sriram Srinivasan | 2016-02-09 |