Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9330999 | Multi-component integrated heat spreader for multi-chip packages | Thomas J. Fitzgerald, Aravindha R. Antoniswamy, Nikunj P. Patel | 2016-05-03 | $11,131,000 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2016-02-09 | $15,927,000 |
| 9257405 | Multi-solder techniques and configurations for integrated circuit package assembly | Rajen S. Sidhu, Wei Hu, Martha A. Dudek | 2016-02-09 | $15,927,000 |