Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461014 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Ram Viswanath, Paul R. Start, Rajasekaran Swaminathan | 2016-10-04 |
| 9394619 | Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby | Mukul Renavikar, Sandeep B. Sane | 2016-07-19 |
| 9283641 | Flux materials for heated solder placement and associated techniques and configurations | Martha A. Dudek, Wei Tan | 2016-03-15 |
| 9257405 | Multi-solder techniques and configurations for integrated circuit package assembly | Wei Hu, Carl Deppisch, Martha A. Dudek | 2016-02-09 |