Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9394619 | Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby | Rajen S. Sidhu, Mukul Renavikar | 2016-07-19 | $7,217,000 |
| 9368461 | Contact pads for integrated circuit packages | Sven Albers, Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe | 2016-06-14 | $9,885,000 |