Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9394619 | Methods of adding dopants to conductive interconnect structures in substrate technologies and structures formed thereby | Rajen S. Sidhu, Mukul Renavikar | 2016-07-19 |
| 9368461 | Contact pads for integrated circuit packages | Sven Albers, Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe | 2016-06-14 |