| 9515049 |
Flexibly-wrapped integrated circuit die |
Michael P. Skinner, Hans-Joachim Barth, Peter Baumgartner, Harald Gossner |
2016-12-06 |
| 9397019 |
Integrated circuit package configurations to reduce stiffness |
Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler, Andreas Wolter |
2016-07-19 |
| 9385105 |
Semiconductor devices |
Thorsten Meyer, Gerald Ofner, Bernd Waidhas, Hans-Joachim Barth, Reinhard Golly +2 more |
2016-07-05 |
| 9373588 |
Stacked microelectronic dice embedded in a microelectronic substrate |
Reinhard Mahnkopf, Wolfgang Molzer, Bernd Memmler, Edmund Goetz, Hans-Joachim Barth +1 more |
2016-06-21 |
| 9368461 |
Contact pads for integrated circuit packages |
Georg Seidemann, Sonja Koller, Stephan Stoeckl, Shubhada H. Sahasrabudhe, Sandeep B. Sane |
2016-06-14 |
| 9343389 |
Magnetic contacts |
Michael P. Skinner, Teodora Ossiander, Georg Seidemann |
2016-05-17 |
| 9312198 |
Chip package-in-package and method thereof |
Thorsten Meyer, Andreas Wolter |
2016-04-12 |