Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9397019 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler | 2016-07-19 | |
| 9312198 | Chip package-in-package and method thereof | Thorsten Meyer, Sven Albers | 2016-04-12 | $10,096,000 |