Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397019 | Integrated circuit package configurations to reduce stiffness | Sven Albers, Sonja Koller, Thorsten Meyer, Georg Seidemann, Christian Geissler | 2016-07-19 |
| 9312198 | Chip package-in-package and method thereof | Thorsten Meyer, Sven Albers | 2016-04-12 |