Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9461014 | Methods of forming ultra thin package structures including low temperature solder and structures formed therby | Sriram Srinivasan, Paul R. Start, Rajen S. Sidhu, Rajasekaran Swaminathan | 2016-10-04 |
| 9391013 | 3D integrated circuit package with window interposer | Debendra Mallik, Sriram Srinivasan, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam | 2016-07-12 |
| 9324678 | Low profile zero/low insertion force package top side flex cable connector architecture | Sanka Ganesan | 2016-04-26 |
| 9265170 | Integrated circuit connectors | Rajasekaran Swaminathan, Sanka Ganesan, Gaurav Chawla, Joshua D. Heppner, Jeffory L. Smalley +4 more | 2016-02-16 |