| 9530740 |
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach |
Kevin J. Lee, Andrew W. Yeoh, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-12-27 |
| 9508821 |
Self-aligned contacts |
Tahir Ghani, Nadia M. Rahhal-Orabi, Subhash M. Joshi, Joseph M. Steigerwald, Jason W. Klaus +2 more |
2016-11-29 |
| 9466565 |
Self-aligned contacts |
Tahir Ghani, Nadia M. Rahhai-Orabi, Subhash M. Joshi, Joseph M. Steigerwald, Jason W. Klaus +2 more |
2016-10-11 |
| 9461143 |
Gate contact structure over active gate and method to fabricate same |
Abhijit Jayant Pethe, Tahir Ghani, Clair Webb, Harry Gomez, Annalisa Cappellani |
2016-10-04 |
| 9449913 |
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias |
Kevin J. Lee, Andrew W. Yeoh, Christopher M. Pelto, Hiten Kothari, Seshu V. Sattiraju +1 more |
2016-09-20 |
| 9391013 |
3D integrated circuit package with window interposer |
Debendra Mallik, Ram Viswanath, Sriram Srinivasan, Andrew W. Yeoh, Sairam Agraharam |
2016-07-12 |
| 9337336 |
Replacement metal gates to enhance tranistor strain |
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2016-05-10 |
| 9276112 |
Semiconductor device having tipless epitaxial source/drain regions |
— |
2016-03-01 |