Debendra Mallik — 8 Patents at Intel

Issued Patents 2016

Showing 1–8 of 8 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9530758	3D integrated circuit package with through-mold first level interconnects	Robert L. Sankman	2016-12-27	$11,980,000
9526285	Flexible computing fabric	Aleksandar Aleksov, Ravindranath V. Mahajan, Sairam Agraharam, Ian A. Young, John C. Johnson +1 more	2016-12-27	$11,980,000
9526175	Suspended inductor microelectronic structures	Mathew J. Manusharow, Mihir K. Roy, Kaladhar Radhakrishnan, Edward A. Burton	2016-12-20	$13,656,000
9478476	Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package	Sridhar Narasimhan, Mathew J. Manusharow, Thomas A. Boyd	2016-10-25	$11,658,000
9391013	3D integrated circuit package with window interposer	Ram Viswanath, Sriram Srinivasan, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam	2016-07-12	$10,128,000
9355242	Method and apparatus for managing and accessing personal data	Sasikanth Manipatruni, Kelin J. Kuhn, John C. Johnson	2016-05-31	$9,993,000
9287248	Embedded memory and power management subpackage	John S. Guzek, Sasha N. Oster, Timothy McIntosh	2016-03-15	$12,478,000
9269701	Localized high density substrate routing	Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan	2016-02-23	$10,383,000