| 9530758 |
3D integrated circuit package with through-mold first level interconnects |
Robert L. Sankman |
2016-12-27 |
| 9526285 |
Flexible computing fabric |
Aleksandar Aleksov, Ravindranath V. Mahajan, Sairam Agraharam, Ian A. Young, John C. Johnson +1 more |
2016-12-27 |
| 9526175 |
Suspended inductor microelectronic structures |
Mathew J. Manusharow, Mihir K. Roy, Kaladhar Radhakrishnan, Edward A. Burton |
2016-12-20 |
| 9478476 |
Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package |
Sridhar Narasimhan, Mathew J. Manusharow, Thomas A. Boyd |
2016-10-25 |
| 9391013 |
3D integrated circuit package with window interposer |
Ram Viswanath, Sriram Srinivasan, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam |
2016-07-12 |
| 9355242 |
Method and apparatus for managing and accessing personal data |
Sasikanth Manipatruni, Kelin J. Kuhn, John C. Johnson |
2016-05-31 |
| 9287248 |
Embedded memory and power management subpackage |
John S. Guzek, Sasha N. Oster, Timothy McIntosh |
2016-03-15 |
| 9269701 |
Localized high density substrate routing |
Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2016-02-23 |