Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9530758 | 3D integrated circuit package with through-mold first level interconnects | Robert L. Sankman | 2016-12-27 |
| 9526285 | Flexible computing fabric | Aleksandar Aleksov, Ravindranath V. Mahajan, Sairam Agraharam, Ian A. Young, John C. Johnson +1 more | 2016-12-27 |
| 9526175 | Suspended inductor microelectronic structures | Mathew J. Manusharow, Mihir K. Roy, Kaladhar Radhakrishnan, Edward A. Burton | 2016-12-20 |
| 9478476 | Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package | Sridhar Narasimhan, Mathew J. Manusharow, Thomas A. Boyd | 2016-10-25 |
| 9391013 | 3D integrated circuit package with window interposer | Ram Viswanath, Sriram Srinivasan, Mark Bohr, Andrew W. Yeoh, Sairam Agraharam | 2016-07-12 |
| 9355242 | Method and apparatus for managing and accessing personal data | Sasikanth Manipatruni, Kelin J. Kuhn, John C. Johnson | 2016-05-31 |
| 9287248 | Embedded memory and power management subpackage | John S. Guzek, Sasha N. Oster, Timothy McIntosh | 2016-03-15 |
| 9269701 | Localized high density substrate routing | Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan | 2016-02-23 |