| 9526175 |
Suspended inductor microelectronic structures |
Mihir K. Roy, Kaladhar Radhakrishnan, Debendra Mallik, Edward A. Burton |
2016-12-20 |
| 9521751 |
Weaved electrical components in a substrate package core |
Mihir K. Roy |
2016-12-13 |
| 9478476 |
Package for a microelectronic die, microelectronic assembly containing same, microelectronic system, and method of reducing die stress in a microelectronic package |
Debendra Mallik, Sridhar Narasimhan, Thomas A. Boyd |
2016-10-25 |
| 9406587 |
Substrate conductor structure and method |
Harold Ryan Chase, Mihir K. Roy, Mark S. Hlad |
2016-08-02 |
| 9275971 |
Bridge interconnect with air gap in package assembly |
Chia-Pin Chiu, Zhiguo Qian |
2016-03-01 |
| 9275975 |
Electronic package and method of connecting a first die to a second die to form an electronic package |
Harold Ryan Chase, Mihir K. Roy |
2016-03-01 |