Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406587 | Substrate conductor structure and method | Harold Ryan Chase, Mihir K. Roy, Mathew J. Manusharow | 2016-08-02 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9299602 | Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package | Qinglei Zhang, Tao Wu, Charavana K. Gurumurthy | 2016-03-29 |
| 9257276 | Organic thin film passivation of metal interconnections | Aleksandar Aleksov, Tony Dambrauskas, Danish Faruqui, Edward R. Prack | 2016-02-09 |