Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508636 | Integrated circuit package substrate | Stefanie M. Lotz | 2016-11-29 |
| 9502336 | Coreless substrate with passive device pads | Yueli Liu | 2016-11-22 |
| 9449923 | Methods of forming substrate microvias with anchor structures | Sri Ranga Sai Boyapati | 2016-09-20 |
| 9299602 | Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package | Tao Wu, Mark S. Hlad, Charavana K. Gurumurthy | 2016-03-29 |
| 9245795 | Methods of forming substrate microvias with anchor structures | Sri Ranga Sai Boyapati | 2016-01-26 |