CG

Charavana K. Gurumurthy

IN Intel: 1 patents #2,105 of 5,207Top 45%
Overall (2016): #442,161 of 481,213Top 95%
1
Patents 2016

Issued Patents 2016

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
9299602 Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package Qinglei Zhang, Tao Wu, Mark S. Hlad 2016-03-29