Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9488483 | Localization using road markings | Ananth Ranganathan | 2016-11-08 |
| 9461679 | System, method, and apparatus for analog signal conditioning of high-speed data streams | Davide Guermandi, Silvian Spiridon, Dongsoo Daniel Koh, Stefano Bozzola, Han Yan +1 more | 2016-10-04 |
| 9391018 | Crosstalk polarity reversal and cancellation through substrate material tuning | Zhichao Zhang, Tolga Memioglu, Kemal Aygun | 2016-07-12 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9331017 | Chip package incorporating interfacial adhesion through conductor sputtering | Islam A. Salama | 2016-05-03 |
| 9299602 | Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package | Qinglei Zhang, Mark S. Hlad, Charavana K. Gurumurthy | 2016-03-29 |
| 9232639 | Non-uniform substrate stackup | Zhichao Zhang, Zhiguo Qian, Kemal Aygun | 2016-01-05 |