Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9505607 | Methods of forming sensor integrated packages and structures formed thereby | Kyu Oh Lee, Zheng Zhou, Feras Eid, Sasha N. Oster, Lay Wai Kong +1 more | 2016-11-29 |
| 9442286 | Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrate | Yonggang Li, Chong Zhang | 2016-09-13 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9361059 | Architecture for seamless integrated display system | Johanna M. Swan, Uygar E. Avci, Ravi Pallarisetty | 2016-06-07 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Mihir K. Roy, Tao Wu, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9331017 | Chip package incorporating interfacial adhesion through conductor sputtering | Tao Wu | 2016-05-03 |
| 9266723 | Misalignment correction for embedded microelectronic die applications | Grant A. Crawford | 2016-02-23 |