Sasha N. Oster — 7 Patents at Intel

Issued Patents 2016

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
9505607	Methods of forming sensor integrated packages and structures formed thereby	Kyu Oh Lee, Zheng Zhou, Islam A. Salama, Feras Eid, Lay Wai Kong +1 more	2016-11-29	$9,403,000
9501068	Integration of pressure sensors into integrated circuit fabrication and packaging	Kyu Oh Lee, Feras Eid, Sarah Haney	2016-11-22	$9,157,000
9397071	High density interconnection of microelectronic devices	Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more	2016-07-19	$7,217,000
9345184	Magnetic field shielding for packaging build-up architectures	Sarah Haney, Weng Hong Teh, Feras Eid	2016-05-17	$8,600,000
9287248	Embedded memory and power management subpackage	John S. Guzek, Debendra Mallik, Timothy McIntosh	2016-03-15	$12,478,000
9260294	Integration of pressure or inertial sensors into integrated circuit fabrication and packaging	Kyu Oh Lee, Feras Eid, Sarah Haney	2016-02-16	$10,295,000
9242854	Hermetic encapsulation for microelectromechanical systems (MEMS) devices	Sarah Haney, Weng Hong Teh, Feras Eid	2016-01-26	$9,792,000