Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9505607 | Methods of forming sensor integrated packages and structures formed thereby | Kyu Oh Lee, Zheng Zhou, Islam A. Salama, Feras Eid, Lay Wai Kong +1 more | 2016-11-29 |
| 9501068 | Integration of pressure sensors into integrated circuit fabrication and packaging | Kyu Oh Lee, Feras Eid, Sarah Haney | 2016-11-22 |
| 9397071 | High density interconnection of microelectronic devices | Omkar G. Karhade, John S. Guzek, Johanna M. Swan, Christopher J. Nelson, Nitin A. Deshpande +6 more | 2016-07-19 |
| 9345184 | Magnetic field shielding for packaging build-up architectures | Sarah Haney, Weng Hong Teh, Feras Eid | 2016-05-17 |
| 9287248 | Embedded memory and power management subpackage | John S. Guzek, Debendra Mallik, Timothy McIntosh | 2016-03-15 |
| 9260294 | Integration of pressure or inertial sensors into integrated circuit fabrication and packaging | Kyu Oh Lee, Feras Eid, Sarah Haney | 2016-02-16 |
| 9242854 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Sarah Haney, Weng Hong Teh, Feras Eid | 2016-01-26 |