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Device, system and method for providing MEMS structures of a semiconductor package |
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Integration of pressure sensors into integrated circuit fabrication and packaging |
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Magnetic field shielding for packaging build-up architectures |
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Integration of pressure or inertial sensors into integrated circuit fabrication and packaging |
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Hermetic encapsulation for microelectromechanical systems (MEMS) devices |
Weng Hong Teh, Feras Eid, Sasha N. Oster |
2016-01-26 |