Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9505610 | Device, system and method for providing MEMS structures of a semiconductor package | Weng Hong Teh, Tarek A. Ibrahim, Daniel N. Sobieski, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more | 2016-11-29 |
| 9501068 | Integration of pressure sensors into integrated circuit fabrication and packaging | Kyu Oh Lee, Sasha N. Oster, Feras Eid | 2016-11-22 |
| 9345184 | Magnetic field shielding for packaging build-up architectures | Sasha N. Oster, Weng Hong Teh, Feras Eid | 2016-05-17 |
| 9312256 | Bidirectional silicon carbide transient voltage supression devices | Sei-Hyung Ryu | 2016-04-12 |
| 9260294 | Integration of pressure or inertial sensors into integrated circuit fabrication and packaging | Kyu Oh Lee, Sasha N. Oster, Feras Eid | 2016-02-16 |
| 9242854 | Hermetic encapsulation for microelectromechanical systems (MEMS) devices | Weng Hong Teh, Feras Eid, Sasha N. Oster | 2016-01-26 |