Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9505607 | Methods of forming sensor integrated packages and structures formed thereby | Zheng Zhou, Islam A. Salama, Feras Eid, Sasha N. Oster, Lay Wai Kong +1 more | 2016-11-29 |
| 9501068 | Integration of pressure sensors into integrated circuit fabrication and packaging | Sasha N. Oster, Feras Eid, Sarah Haney | 2016-11-22 |
| 9391025 | Reliable microstrip routing for electronics components | Omkar G. Karhade, Nevin Altunyurt, Krishna Bharath | 2016-07-12 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Yueli Liu | 2016-05-31 |
| 9260294 | Integration of pressure or inertial sensors into integrated circuit fabrication and packaging | Sasha N. Oster, Feras Eid, Sarah Haney | 2016-02-16 |