Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9526175 | Suspended inductor microelectronic structures | Mathew J. Manusharow, Kaladhar Radhakrishnan, Debendra Mallik, Edward A. Burton | 2016-12-20 |
| 9521751 | Weaved electrical components in a substrate package core | Mathew J. Manusharow | 2016-12-13 |
| 9406587 | Substrate conductor structure and method | Harold Ryan Chase, Mathew J. Manusharow, Mark S. Hlad | 2016-08-02 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Tao Wu, Yueli Liu, Kyu Oh Lee | 2016-05-31 |
| 9275975 | Electronic package and method of connecting a first die to a second die to form an electronic package | Harold Ryan Chase, Mathew J. Manusharow | 2016-03-01 |
| 9236366 | High density organic bridge device and method | Stephanie M. Lotz, Wei-Lun Kane Jen | 2016-01-12 |