Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502336 | Coreless substrate with passive device pads | Qinglei Zhang | 2016-11-22 |
| 9412625 | Molded insulator in package assembly | — | 2016-08-09 |
| 9355952 | Device packaging with substrates having embedded lines and metal defined pads | Mark S. Hlad, Islam A. Salama, Mihir K. Roy, Tao Wu, Kyu Oh Lee | 2016-05-31 |