Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406641 | Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereof | Ting-Hao Lin, Yi-Fan Kao, Shuo-Hsun Chang, Kuo-Chun Huang | 2016-08-02 |
| 9370110 | Method of manufacturing a multilayer substrate structure for fine line | Ting-Hao Lin | 2016-06-14 |
| 9301405 | Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole | Ting-Hao Lin, Yi-Fan Kao, Jaen-Don Lan, Yung-Lin Chia, An-Ping Tseng | 2016-03-29 |