Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9439292 | Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure | Ting-Hao Lin, Yi-Fan Kao, Yung-Lin Chia, An-Ping Tseng | 2016-09-06 |
| 9301405 | Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-hole | Ting-Hao Lin, Yi-Fan Kao, Yu-Te Lu, Yung-Lin Chia, An-Ping Tseng | 2016-03-29 |