Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9520350 | Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer | Weng Hong Teh, Emile Davies-Venn, Ebrahim Andideh, Digvijay A. Raorane | 2016-12-13 | $15,488,000 |
| 9505610 | Device, system and method for providing MEMS structures of a semiconductor package | Weng Hong Teh, Tarek A. Ibrahim, Sarah Haney, Parshuram Balkrishna Zantye, Chad Eric Mair +1 more | 2016-11-29 | $9,403,000 |
| 9420693 | Integration of embedded thin film capacitors in package substrates | Robert L. Sankman, Sri Ranga Sai Boyapati | 2016-08-16 | $10,311,000 |
| 9232686 | Thin film based electromagnetic interference shielding with BBUL/coreless packages | Digvijay A. Raorane, Kemal Aygun, Drew W. Delaney | 2016-01-05 | $11,513,000 |