Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520350 | Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer | Weng Hong Teh, Emile Davies-Venn, Digvijay A. Raorane, Daniel N. Sobieski | 2016-12-13 |