Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520350 | Bumpless build-up layer (BBUL) semiconductor package with ultra-thin dielectric layer | Weng Hong Teh, Emile Davies-Venn, Ebrahim Andideh, Daniel N. Sobieski | 2016-12-13 |
| 9397079 | Multichip integration with through silicon via (TSV) die embedded in package | Yonggang Li, Rahul N. Manepalli, Javier Soto Gonzalez | 2016-07-19 |
| 9232686 | Thin film based electromagnetic interference shielding with BBUL/coreless packages | Kemal Aygun, Daniel N. Sobieski, Drew W. Delaney | 2016-01-05 |