Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9458283 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Nisha Ananthakrishnan, Hong Dong, Nachiket R. Raravikar, Gregory S. Constable | 2016-10-04 |
| 9397079 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Javier Soto Gonzalez | 2016-07-19 |
| 9312233 | Method of forming molded panel embedded die structure | Hamid Azimi, John S. Guzek | 2016-04-12 |