Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9312233 | Method of forming molded panel embedded die structure | Rahul N. Manepalli, John S. Guzek | 2016-04-12 |
| 9257380 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Javier Soto Gonzalez, Drew W. Delaney | 2016-02-09 |