Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9397079 | Multichip integration with through silicon via (TSV) die embedded in package | Digvijay A. Raorane, Yonggang Li, Rahul N. Manepalli | 2016-07-19 |
| 9257380 | Forming functionalized carrier structures with coreless packages | Ravi Kiran Nalla, John S. Guzek, Drew W. Delaney, Hamid Azimi | 2016-02-09 |