Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9458283 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Nisha Ananthakrishnan, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar | 2016-10-04 | $11,494,000 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Deepak Kulkarni, Carl Deppisch, Leonel Arana, Sriram Srinivasan | 2016-02-09 | $15,927,000 |