Issued Patents 2016
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Chia-Pin Chiu, Tannaz Harirchian, John S. Guzek | 2016-12-13 |
| 9496211 | Logic die and other components embedded in build-up layers | Russell K. Mortensen, John S. Guzek | 2016-11-15 |
| 9269701 | Localized high density substrate routing | Robert Starkston, Debendra Mallik, John S. Guzek, Chia-Pin Chiu, Ravi Mahajan | 2016-02-23 |
| 9254532 | Methods of fabricating low melting point solder reinforced sealant and structures formed thereby | Carl Deppisch, Leonel Arana, Gregory S. Constable, Sriram Srinivasan | 2016-02-09 |