Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, John S. Guzek | 2016-12-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520376 | Bumpless build-up layer package including an integrated heat spreader | Weng Hong Teh, Deepak Kulkarni, Chia-Pin Chiu, John S. Guzek | 2016-12-13 |