Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9504168 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Sivakumar Nagarajan, Sandeep Razdan, Craig J. Weinman, Kabirkumar Mirpuri | 2016-11-22 |
| 9458283 | Flexible underfill compositions for enhanced reliability | Dingying Xu, Hong Dong, Rahul N. Manepalli, Nachiket R. Raravikar, Gregory S. Constable | 2016-10-04 |
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora +3 more | 2016-08-30 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Yonghao Xiu +3 more | 2016-05-03 |
| 9269596 | Narrow-gap flip chip underfill composition | Yonghao Xiu, Yiqun Bai, Arjun Krishnan | 2016-02-23 |