Issued Patents 2016
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520333 | Wafer level package and fabrication method thereof | Shing-Yih Shih, Hsu Chiang | 2016-12-13 |
| 9496358 | Semiconductor device and fabrication method therefor | Tzung-Han Lee, Yaw Wen Hu, Heng Hao Hsu, Yu Jing Chang, Hsu Chiang | 2016-11-15 |
| 9455243 | Silicon interposer and fabrication method thereof | Shih-Fan Kuan | 2016-09-27 |
| 9449953 | Package-on-package assembly and method for manufacturing the same | Shing-Yih Shih | 2016-09-20 |
| 9437583 | Package-on-package assembly and method for manufacturing the same | Shing-Yih Shih | 2016-09-06 |