Issued Patents 2016
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520333 | Wafer level package and fabrication method thereof | Neng-Tai Shih, Hsu Chiang | 2016-12-13 |
| 9449935 | Wafer level package and fabrication method thereof | Tieh-Chiang Wu | 2016-09-20 |
| 9449953 | Package-on-package assembly and method for manufacturing the same | Neng-Tai Shih | 2016-09-20 |
| 9437583 | Package-on-package assembly and method for manufacturing the same | Neng-Tai Shih | 2016-09-06 |
| 9397048 | Semiconductor structure and manufacturing method thereof | Tieh-Chiang Wu | 2016-07-19 |
| 9379197 | Recess array device | Tieh-Chiang Wu | 2016-06-28 |