Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9504168 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman | 2016-11-22 |
| 9324680 | Solder attach apparatus and method | — | 2016-04-26 |