Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9504168 | Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process | Sivakumar Nagarajan, Sandeep Razdan, Nisha Ananthakrishnan, Craig J. Weinman | 2016-11-22 | $9,157,000 |
| 9324680 | Solder attach apparatus and method | — | 2016-04-26 | $9,347,000 |